I. Synergistic Optimization of High Thermal Conductivity and Insulation Performance
Through molecular structure design, silicone oil emulsions have achieved dual breakthroughs in thermal conductivity and insulation in electronic packaging. Thermal interface materials (TIMs) made from nano-alumina (Al₂O₃) and silicone oil emulsions achieve a thermal conductivity of up to 3.5 W/(m·K), a five-fold improvement over pure silicone oil, while maintaining a volume resistivity exceeding 10¹⁴Ω·cm. In 5G base station power amplifier packaging, this material reduces device operating temperature by 15°C and signal distortion by 0.8 dB, significantly improving communication stability. Test data from one manufacturer shows that server CPUs using silicone oil emulsion-based TIMs maintain temperatures below 68°C at full load, extending their service life by 2.3 times compared to traditional silicone grease solutions.

II. Rheology Control Technology in Miniaturized Packaging
To meet the micron-level gap filling requirements of chip-scale packaging (CSP) and system-in-package (SiP), silicone oil emulsions achieve precise control through rheological modification. By introducing fumed silica (SiO₂) as a thixotropic agent, an emulsion system with shear-thinning properties has been developed. Within the shear rate range of 0.1-100 s⁻¹, the viscosity can be dynamically adjusted over three orders of magnitude, automatically adapting to process stages such as dispensing, leveling, and curing. In smartphone SoC packaging, this technology reduces underfill time to 8 seconds, achieves a void rate below 0.5%, and increases yield to 99.7%, enabling stable packaging of 7nm process chips in high-end models.

III. Innovations in Environmentally Friendly Packaging Materials
Silicone oil emulsions, with their advantages as a water-based system, are driving the transition to green manufacturing in electronic packaging. Traditional epoxy resin encapsulation materials require the use of toxic solvents such as N-methylpyrrolidone (NMP). Silicone oil emulsions offer a water-based alternative through emulsification technology. Conformal coatings based on polyether-modified silicone oil emulsions have demonstrated outstanding performance in printed circuit board (PCB) protection: curing energy consumption is reduced by 40%, volatile organic compound (VOC) emissions are reduced by 92%, and salt spray resistance lasts for over 1,000 hours. In a new energy vehicle electronic control system application, PCBs coated with water-based silicone oil emulsions exhibited no cracking during temperature cycling tests from -40°C to 150°C, demonstrating a threefold improvement in reliability compared to solvent-based coatings.

IV. Material Innovation in Flexible Electronic Packaging
With the explosive growth of the wearable device market, silicone oil emulsions are demonstrating unique value in flexible electronic packaging. By combining liquid metal particles (such as gallium-indium alloys) with silicone oil emulsions, a packaging material with both conductivity and flexibility has been developed. This material maintains a resistivity of 10⁻⁴Ω·cm even under 50% strain and has been successfully applied to the curved display encapsulation of smart wristbands. Tests have shown that products using this technology exhibit no cracks in the encapsulation layer after 100,000 bending cycles, with signal transmission loss increasing by less than 2%. This provides a key material solution for the commercialization of flexible electronic products.